中国组织工程研究

中国组织工程研究 ›› 2011, Vol. 15 ›› Issue (38): 7139-7141.doi: 10.3969/j.issn.1673-8225.2011.38.025

• 材料力学及表面改性 material mechanics and surface modification • 上一篇    下一篇

氮离子溅射对镍铬合金表面细菌黏附的影响

史艳蕾   

  1. 上海市长宁区中心医院口腔科，上海市  200336
  • 收稿日期:2011-03-19 修回日期:2011-08-26 出版日期:2011-09-17 发布日期:2011-09-17
  • 作者简介:史艳蕾，女，1980年生，江苏省如皋市人，汉族，2003年同济大学口腔医学院毕业，主治医师，主要从事口腔修复学方面的研究。 ericzhongmu@ 163.com

Influence of N+ ion sputtering on bacteria adhesion of Ni-Cr alloy

Shi Yan-lei   

  1. Department of Stomatology, Changning Center Hospital of Shanghai, Shanghai  200336, China
  • Received:2011-03-19 Revised:2011-08-26 Online:2011-09-17 Published:2011-09-17
  • About author:Shi Yan-lei, Attending physician, Department of Stomatology, Changning Center Hospital of Shanghai, Shanghai 200336, China ericzhongmu@ 163.com

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摘要：

背景：镍铬合金被广泛应用于口腔修复领域，大量实验正在进行其机械性能、抗腐蚀性能以及生物相容性的研究。
目的：观察氮离子溅射对镍铬合金表面细菌黏附能力的影响。
方法：制作镍铬合金试件144件，随机选出72件，采氮离子溅射法对其表面改性，镍铬合金组为对照组，氮离子溅射组为实验组。对两组试件表面黏附血型链球菌、黏性放线菌、白色念珠菌，分别进行细菌体外黏附实验。用菌落形成单位计数法统计分析氮离子溅射前后各种细菌黏附量的变化。
结果与结论：在细菌黏附24，48，168 h，上述3种细菌在实验组表面黏附量较对照组表面黏附量显著减少(P < 0.001)。提示，氮离子溅射可抑制镍铬合金表面细菌黏附。

关键词: 镍铬合金, 氮离子溅射, 细菌黏附, 链球菌, 黏性放线菌, 白色念珠菌

Abstract:

BACKGROUND: Ni-Cr alloy is widely used in dental field. A large number of experiments have been performed to study its mechanical properties, corrosion resistance and biocompatibility.
OBJECTIVE: To study the influence of N+ ion sputtering on bacteria adhesion of clinically used Ni-Cr alloy.
METHODS: A hundred and forty-four pieces of Ni-Cr alloy were made, and 72 were randomly chosen. Then N+ ion sputter was used to the surface modification of chosen Ni-Cr alloys as experimental group, while others served as controls. Strep. sanguis, Actinomyces viscosus, Candida albicans were adhered onto the surfaces of Ni-Cr alloys, and then the number of bacteria was assayed by means of clone forming unit (CFU) method.
RESULTS AND CONCLUSION: At 24, 48 and 168 hours, the number of the adhered Strep. sanguis, Actinomyces viscosus, Candida albicans was significantly reduced in N+ ion sputtering Ni-Cr alloy group (P < 0.001), indicating that N+ ion sputtering may reduce bacterium adhesion on Ni-Cr alloy.

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