Nano copper/low-density polyethylene intrauterine device reduces post-implantation uterine bleeding and pain

doi:10.3969/j.issn.2095-4344.2015.30.005

Abstract

Abstract:

BACKGROUND: Intrauterine device made of bare copper can release a great amount of oxides that are easy to cause bleeding and pain in women. Nano copper/low-density polyethylene intrauterine device can well solve the above drawbacks, which is conducive to the maintenance of the reproductive health of women of childbearing age.
OBJECTIVE: To explore the effect of nano copper/low-density polyethylene intrauterine device on post-implantation uterine bleeding and pain.
METHODS: A total of 98 voluntary women asking for intrauterine device insertion were selected and randomized into control group (n=49) with 220C (TCu220C) T type copper intrauterine device and observation group (n=49) with nano copper/low-density polyethylene intrauterine device. All the women were followed up for 12 months, and incidence of adverse events, including uterine bleeding and pain, was observed and compared between the two groups.
RESULTS AND CONCLUSION: During the follow-up, there were one case of uterine bleeding and two cases of pain in the observation group and the incidence of adverse events was 6%; in the control group, there were five cases of uterine bleeding and eight cases of pain, and the incidence of adverse events was 27%. There was a significant difference in the incidence of adverse events between the two groups (P < 0.05). These findings indicate that the nano copper/low-density polyethylene intrauterine device can effectively reduce the occurrence of uterine bleeding and pain after implantation.

中国组织工程研究杂志出版内容重点：生物材料；骨生物材料; 口腔生物材料; 纳米材料; 缓释材料; 材料相容性；组织工程

Key words: Polyethylene, Intrauterine Devices, Uterine Hemorrhage

CLC Number:

R318

Liu Juan-ni, Yan Fei-yan, Wang Yan. Nano copper/low-density polyethylene intrauterine device reduces post-implantation uterine bleeding and pain[J]. Chinese Journal of Tissue Engineering Research, 2015, 19(30): 4779-4783.

Figures/Tables 1

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